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GPU computing processor - Alveo U50 - 8 GB HBM2 - PCIe 3.0 x16 / PCIe 4.0 x8 low profile - QSFP28 - fanless - for ThinkSystem SR645 7D2X, 7D2Y; SR665 7D2V, 7D2W
Main Specifications | |
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Product Description | Xilinx Alveo U50 Data Center Accelerator Card - GPU computing processor - Alveo U50 - 8 GB |
Device Type | GPU computing processor - low profile |
Bus Type | PCI Express 3.0 x16 / PCI Express 4.0 x8 |
Graphics Engine | Xilinx Alveo U50 |
Memory | 8 GB HBM2 |
Fanless | Yes |
Dimensions (WxDxH) | 6.6 in x 2.7 in |
Manufacturer Warranty | 1-year warranty |
Designed For | ThinkSystem SR645 7D2X, 7D2Y; SR665 7D2V, 7D2W |
General | |
Device Type | GPU computing processor - low profile - fanless |
Bus Type | PCI Express 3.0 x16 / PCI Express 4.0 x8 |
Graphics Engine | Xilinx Alveo U50 |
Features | UltraScale+ architecture |
Memory | |
Size | 8 GB |
Technology | HBM2 |
Bandwidth | 316 GBps |
Manufacturer Warranty | |
Service & Support | Limited warranty - 1 year |
Miscellaneous | |
Power Consumption Operational | 75 Watt |
Included Accessories | Low-profile bracket, full-height bracket |
Compliant Standards | C-Tick, GS, FCC Part 15, UL 60950-1 Second Edition, CSA C22.2 No. 60950-1-07 Second Edition, VCCI Class A, MSIP, CNS 13438, IEC 60950-1:2005 Second Edition, EMC 2014/30/EU, LVD 2014/35/EU, IEEE 1588, EN 55032:2015, CISPR 32, IEC 62368-1: 2014 Second Edition, RoHS CNS 15663, EN 55035:2017, AS/NZS CISPR 32, CAN ICES-3(A)/NMB3(A), EN 60950-1:2006+A11:2009+A1:2012+A2:2011+A2:2013 |
Depth | 6.6 in |
Height | 2.7 in |
Weight | 11.46 oz |
Environmental Parameters | |
Min Operating Temperature | 32 °F |
Max Operating Temperature | 122 °F |
Humidity Range Operating | 8 - 80% |
Compatibility Information | |
Designed For | Lenovo ThinkSystem SR645 7D2X, 7D2Y ¦ Lenovo ThinkSystem SR665 7D2V, 7D2W |